| 摘要 |
PURPOSE:To prevent the excessive close contact of a wafer and to make the separativity from a resist film excellent by forming a double resin film made of a PVA film and a silicone resin film on a photomask surface. CONSTITUTION:The PVA film 2 is applied to a photomask substrate 1, and formed by curling in a parabolic direction in a drying step owing to its inherent feature. The silicone resin film 3 is applied and formed on the PVA film 2. When a photomask circuit pattern is transferred on a wafer, the photomask is brought into contact with the wafer. Since the photomask surface curls due to the action of the PVA film 2 at this time, its excessive close adhesion to the wafer surface can be prevented. As the silicone resin film 3 excellent in separativity from the resist film directly touches the wafer instead of the PVA film 2, the peel-off of the resist film can be effectively prevented when the photomask is separated from the wafer. |
