| 摘要 |
<p>A method and a device are used to remove orthodontic brackets (4) or other metallic dentistry objects bonded to the tooth enamel (1) whereby the adhesiveness of the adhesive layer (3) located between the bracket or object and the tooth enamel is reduced by heat. While the adhesive layer is affected the patient's tooth is effectively protected so that no heating of the tooth itself can occur. This is attained by direct heating with an electric resistance.</p> |
