| 摘要 |
<p>PURPOSE:To avoid an interlayer shortcircuit of matrix wirings by forming wirings of a driving circuit substrate for a display unit by arranging thin film switching elements in a matrix state of a metal film capable of being oxidized, when forming the substrate, and heat treating to convert the surface to an insulator layer. CONSTITUTION:When a conductor layer made of Ta is formed on a transparent insulating substrate 1 made of glass, the layer is composed of address wirings 2-1 extending longitudinally, a gate electrode 2-2 branched from the midway, and a wiring pad 2-3 disposed at the end. Then, the layer except the electrode 2-2 is subjected to an anodic oxidation to convert to an insulating film 4, another insulating film 3 is coated on the electrode 2-2, an N<+> type a-Si conductor layer 5 is mounted on the film 3, a contacting hole 3-2 is opened in the pad 2-3, and a pad electrode 8-4 is buried. Thereafter, picture element electrodes 6 are formed on the film 4, a source electrode 8-2 and a drain electrode 8-3 are formed on the layer 5, and data wirings 8-1 crossed perpendicularly to the electrode 8-2 are formed.</p> |
