Epoxy resin composition

摘要

An epoxy resin composition which comprises: (a) an epoxy resin having an epoxy equivalent of at most 200; (b) a condensation mixture of 1 mol of a polybasic carboxylic acid anhydride, from 0.07 to 0.3 mol of a bisphenol A having the formula: <IMAGE> (I) and from 0.07 to 0.3 mol of a monohydric phenol having the formula: <IMAGE> (II) wherein R is an alkyl group, as a curing agent; and (c) an inorganic powder, as a filler.