发明名称 FILM FORMING DEVICE
摘要 PURPOSE:To efficiently produce the title device while the quality of the adherent used is maintained excellently by a method wherein a tank is provided in such a manner that the holes, where a substrate passes through, of the adjoining treatment chambers are interconnected. CONSTITUTION:When the doors 29 of the holes 27b and 27c to be used to send a substrate to the next reaction chamber 20b are opened and a roller conveyer 26 is operated, the adhered matters are exfoliated and refloated, they are removed in a vacuum chamber 20d, and the flow in of the foreign matters into the vacuum chamber 20d is prevented. Also, adhesion matters adhere little by little on the packing and the like of a door 29, and finally, there are cases where a gas leak occurs. However, as vacuum chambers 20d and 20e are provided between adjoining reaction chambers 20a and 20b, or 20b and 20c, the directly leaked gas does not come in the adjoining reaction chambers 20a and 20b, or 20b and 20c. The substrate is sent to the vacuum chamber 20d by opening the door 29 only of the passing hole 27e located between the substrate carrying reaction chamber 20a and the adjoining chamber 20d. Then the door 29 is closed, and the substrate is sent to the next reaction chamber 20b adjoining to the vacuum chamber 20d by opening the door 29 of the passing hole 27b of the reaction chamber 29b.
申请公布号 JPS6265323(A) 申请公布日期 1987.03.24
申请号 JP19850205672 申请日期 1985.09.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 IZUMO MASAO
分类号 H01L31/04;H01L21/205 主分类号 H01L31/04
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