| 摘要 |
<p>PURPOSE:To reduce stress in a sealing resin without impairing reliability and to cope with the implementation of a large semiconductor device, by using a specified epoxy resin composition, and sealing a semiconductor element. CONSTITUTION:An epoxy resin composition is obtained by using at least one component, which is selected in groups comprising the following components: an epoxy resin (A component); a phenol resin (B component); polydimethylsiloxane oligomer (C component), which has at least one first- or secondary amino group in a molecule; an addition reaction product (D component) of C component and a monoepoxy compound expressed by the Formula 1; and an addition reaction product (E component) of the C component, the monoepoxy compound expressed by the Formula 1 and a bisphenol A type epoxy resin. In the semiconductor device obtained in this way, inner stress in the hardened body of the epoxy resin composition is low. Therefore, the device has very excellent electric characteristics and low stress property.</p> |
