| 摘要 |
PURPOSE:To facilitate the management of a manufacturing line, by detecting the position of an electrode, measuring electric characteristics, selecting the optimum wire bonding program in correspondence with the difference in characteristics, and performing wiring connection based on the program. CONSTITUTION:The position of an electrode 1a of a device piece 1 of an integrated circuit is detected. Then, a measuring probe 2 is contacted with the electrode 1a by a mechanism part 3. The characteristics of the device piece 1 of the integrated circuit are measured and judged in a judging part 4 through the measuring probe 2. Two or more bonding programs corresponding to the electric characteristics of the device piece 1 of the integrated circuit are stored in a memory part 5. Based on the output of the judging part 4, the optimum bonding program is selected in the memory part 5. Wiring connection is performed by a bonding part 6 in accordance with the program. |
