| 摘要 |
PURPOSE:To omit a special resin removing mold when tie bars are cut and to prevent cracks from occurring in the resin, by providing the tie bars in close proximity to resin sealing parts, partially removing the thick part of the cutting part of each tie bar, and reducing the area of the cutting part. CONSTITUTION:A semiconductor element mounting region 4 is located at the center. Leads, whose tips have noble metal plated films 3, are linked with tie bars 1. Each tie bar 1 is provided in the vicinity of a resin sealing line 2. The thickness on the side of the resin sealing line 2 is kept at the same thickness of each lead. The thickness on the other side is made thinner than the thickness of the lead by 1/2-1/3. The thin part is indicated by 1a. Therefore, cracks are not yielded in a resin, which seals a semiconductor device, due to stress at the time of cutting the tie bars 1. Thus moisture resistance is improved. |
