| 摘要 |
<p>PURPOSE:To form a semiconductor device having excellent reliability, by using a specified epoxy resin composition, sealing a semiconductor element with said composition, thereby largely reducing the amount of a hardening accelerator or making the amount to be none. CONSTITUTION:An epoxy resin composition is obtained singly or using the following material together: an epoxy resin (A component); a phenol resin (B component); a heterocyclic compound, which has at least two secondary amino groups within a molecule (C component); and an addition reaction product of a compound, which has at least two epoxy groups within a molecule, and a heterocyclic compound, which has at least two secondary amino groups within the molecule (D component). Thus, the amount of use of a hardening accelerator is controlled within a range of 0-0.5% with respect to the total amount of the epoxy resin (A component) and the phenol resin (B component). In this way, moisture resistance, electric characteristics and the like can be largely improved.</p> |
