| 摘要 |
PURPOSE:To effectively cool an electronic part package having heat quantity by mounting a cooling fin on the package in which electronic circuit elements are mounted, and vibrating the fin itself. CONSTITUTION:A semiconductor element 2 is mounted on a ceramics base 11, and sealed with low melting point glass to form an electronic part. A ceramics support 5 is formed of a bonding material such as epoxy resin outside the base 11, a cooling fin 6 made, for example, of brass is mounted on the susceptor 5, and piezoelectric elements 71, 72 are bonded to both side surfaces of the film 6 to construct a bimorph vibrator. An AC voltage is applied to the vibrator to vibrate the tip of the fin 6. Thus, the heat dissipation effect of the fin 6 is largely improved. |
