| 摘要 |
PURPOSE:To prevent the liquid level coating of oxidized layer and to adhere a trace quantity of solder correctly to the prescribed place by providing the overflow pass extending to the horizontal direction at the upper end part of a conduit path, by releasing the upper face of the tip part thereof and by forming the side end edge of the said released face sharply. CONSTITUTION:A melted solder 2 is press-fed from a suction port 6 to a conduit path 3 with its suction by operating the pump 4 providing a tank 1 and is overflowed from the outlet port 9b to the tank 1 via the part 9B extending in the horizontal direction of an overflow pass 9. The soldering is performed by dipping the metal needle P around which a coil C is twined, in case of a solenoid S, in the flow of the solder 2 on the releasing face 12 which is not covered by the cover plate 10 of the part 9B. The adhesion and deposition of oxides are checked even in case of the solder 2 coming into contact with the atmosphere on the released face 12 being oxidized by sharply forming the end edge 11 of the cover body directing for the released face 12. And it is preferable to form the passage area of the pass 9 smaller than the conduit path 3. |
