| 摘要 |
<p>A unitary electronic circuit element has an interconnect surface at which it is provided with contact pads and is mounted on a circuit board using a flexible, sheet-form interconnect member that comprises dielectric material and runs of electrically conductive material. Each conductor run extends between a contact pad that is exposed at a first main face of the interconnect member and a termination point that is exposed at a second main face of the interconnect member. The interconnect surface of the electronic circuit element and the second main face of the interconnect member are placed in mutually confronting relationship, and the circuit element is attached to the second main face of the interconnect member by way of its interconnect surface, whereby electrically conductive contact is established between the contact pads of the circuit element and the corresponding termination points of the interconnect member. The circuit element is attached by way of its back face to a thermally conductive plate that has, at one main face, pressure pads that at least partially surround a circuit element receiving area of the plate. The first main face of the interconnect member and the main face of the circuit board are placed in mutually confronting relationship, with the contact pads of the interconnect member touching corresponding contact pads of the circuit board. The plate and the circuit board are clamped together, whereby the pressure pads supply contact force to maintain the contact pads of the interconnect member in electrically conductive pressure contact with the corresponding contact pads of the circuit board.</p> |
