| 摘要 |
<p>A substrate (3) having conductive wirings (1) carries at least one electronic component (4), such as an IC chip, having a plurality of leads connected (5) to said conductive wirings.…A fluid silicone material (11, 21) is provided on said substrate at least to fill the space beneath said leads or even to completely embed the leads. A hardened s ilicone material (12, 22) is provided to cover said fluid silicone material.</p> |
