COPPER ALLOYS FOR SUPPRESSING GROWTH OF CU-AL INTERMETALLIC COMPOUNDS

摘要

Copper alloys are disclosed which may be bonded to aluminum containing members with reduced formation of undesirable copper-aluminum intermetallic compounds. The copper alloys consist essentially of about 15% to about 30% nickel and the balance essentially copper and have particular utility in integrated circuit assemblies as lead frames, lead wires and beam lead tapes. The nickel addition in the alloys suppresses the nucleation rate and the subsequent growth rate of copper-aluminum intermetallic compounds.