| 摘要 |
<p>PURPOSE:The titled filler, obtained by heat-treating synthetic quartz glass pow der, containing no alkali ions with remarkably low contents of halogen elements and suitable for IC, LSI package molding compounds. CONSTITUTION:Synthetic quartz glass powder which is powder obtained by pulverizing a lump of synthetic quartz glass to <=30mu average particle diameter or fumed silica prepared by oxidatively decomposing a volatile silicon halide compound with a flame and containing <=1ppb radioactive elements, e.g. uranium, is heat-treated in an inert gas atmosphere or air at 400-1,500 deg.C for >=5min to afford the titled filler with <=10ppm contents of halogen elements and <=20muS electric conductivity (value obtained by dipping the powder in hot water at 160 deg.C for 20hr and measuring the electric conductivity of the extracted water) without corroding Al wiring in the interior of LSI and causing dielectric breakdown or corrosion of processed products.</p> |
