| 摘要 |
A housing for an optoelectronic circuit module useful in a glass fiber communications system including a luminous flux suspended into the housing. The flux is conducted in a vacuum or a gas, between first and second mutually positioned optical components. The first optical component is attached to the housing via a first support, and a second optical component is attached to the housing via a second support. The first support is installed in one of the housing walls or inside the housing and the second support is rigidly attached to an interior section of the housing. In operation, at least the second support is subjected to large temperature variations of e.g., between -40 DEG C. and +130 DEG C. At least the interior section of the housing which is adjacent to the second support is comprised of a first weldable material and has a first linear thermal expansion coefficient. At least a portion of the second support which is adjacent to the interior section of the housing is comprised of a second weldable material which has a second linear thermal expansion coefficient which differs from the first expansion coefficient. Installed inside the housing is at least one electronic component, e.g., an infrared light-emitting diode which, during operation, produces increases in temperature inside the housing due to waste heat. The second support is located adjacnet to the interior section of the housing, but is welded via only a comparatively small point-like spot to the interior section. |
