| 摘要 |
PURPOSE:To shorten a heat cycle in a die-bonding of a semiconductor chip to a stem by a method wherein a mounting arm is provided with a heating unit and the chip attracted to a capillary is preheated. CONSTITUTION:In an atmosphere of inert gas, first a stem 3 is positioned to a placing stage 2 and is placed thereon, while a semiconductor chip 6 attracted to the capillary 5 of a mounting arm 4 is fed on the stem 3 on the placing stage 2. During this conveyance, as the capillary 5 is heated to about 500 degrees by a heating unit 7, the chip 6 is preheated through the capillary 5. In this state, the chip 6 is positioned to the stem 3 with high precision and is placed on the stem 3. Then, a heating unit 1 is passed a current and a die-bonding of the semiconductor chip 6 to the stem 3 ends. |
