| 摘要 |
PURPOSE:To execute a positioning with high accuracy without a change in the position of the mounting reference face of a stem even through the stem is thermally expanded by a method wherein a heating unit is provided with a placing reference face and the mounting reference face of the stem is abutted on this placing reference face to place the stem on the heating unit. CONSTITUTION:A stem 3 is positioned to a heating unit 2 in the state that its mounting reference face 3a is abutted on the placing reference face 2a of the heating unit 2 and is placed thereon. In this state, a semiconductor chip 6 is positioned to the stem 3 with high accuracy and is placed on the stem 3. Then, a heating unit 2 is passed a current and the steam 3 is heated to about 200 degrees. At this time, the stem 3 is heated by heat conduction from the heating unit 2 and is thermally expanded, but the position of the mounting reference face 3a of the stem 3 is never changed because the mounting reference face 3a is being abutted on the placing reference face 2a of the heating unit 2. As a result, the protrusion quantity of the semiconductor chip 6 can be positioned with high precision. |
