| 摘要 |
PURPOSE:To prevent the disconnection of Al wirings due to corrosion or oxidation by a method wherein an insulation fil or a conductive film coating conductor wirings is left only on both sides of the conductor wirings by anisotropic etching. CONSTITUTION:The Al wirings 2 are formed on a semiconductor substrate 1, and next a PSG (phospho-silicate glass) film 4 is adhered over the whole surface. Then, the film 4 is etched by anisotropic etching and thus left only side surfaces of the wirings 2. A PSG film 5 is adhered again over the whole surface. In such a manner, discontinuous lines do not appear on the film 5, and the wirings 2 are protected by complete coating and then prevented from oxidation. |
