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发明名称
METHOD FOR MEASURING THICKNESS OF SILICON WAFER
摘要
申请公布号
JPS6257225(A)
申请公布日期
1987.03.12
申请号
JP19850197207
申请日期
1985.09.06
申请人
SUMITOMO ELECTRIC IND LTD
发明人
MORIKAWA HISASHI;NAKANO HIROYUKI;NISHIGUCHI KATSUNORI
分类号
H01L21/66;G01B5/06;G01B21/08
主分类号
H01L21/66
代理机构
代理人
主权项
地址
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