Method and device for soldering surface-mountable components on printed circuit boards (circuit carrying boards) with track patterns

摘要

To solder surface-mountable components quickly and precisely on printed circuit boards with track patterns, the heat energy to re-liquefy a solder coating provided on the terminal contacts of the relevant component using a soldering tool is conducted via the area of the printed circuit board tracks immediately next to the soldering joints, and not via the terminal contacts of the component, while at the same time the positioning of the component on the tracks is maintained by separate positioning and pressure devices.