| 发明名称 |
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| 摘要 |
A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned so that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels. |
| 申请公布号 |
JPS6211509(B2) |
申请公布日期 |
1987.03.12 |
| 申请号 |
JP19790080265 |
申请日期 |
1979.06.27 |
| 申请人 |
INTAANASHONARU BIJINESU MASHIINZU CORP |
发明人 |
SEBUJIN OKUTEI;JERAADO JEI TOGAASEN;AREKISANDAA SHII UON |
| 分类号 |
H05K7/20;H01L23/42;H01L23/427;H01L23/44;H01L23/473 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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