| 摘要 |
<p>A socket for interconnecting a leadless integrated circuit chip (24) to a printed circuit board (11) comprises a plurality of substantially L-shaped flexible connectors (15,16) mounted along the edges of an insulated carrier substrate (21). Bottom portions of connectors (15,16) are soldered to the conductor highways (12,13) on the printed circuit board via solder layers (14,18), while the upper leg portions are bent around the edges of the substrate (21) and soldered to chip contacts (22, 23). The arrangement eliminates problems of thermal stress and vibration. <IMAGE></p> |
