| 发明名称 |
INTEGRATED CIRCUIT PACKAGE WITH INTEGRAL HEAT DISSIPATING MEANS |
| 摘要 |
Integral heat dissipating ribs or troughs are formed on the cover or base or both of integrated circuit packages. Depending upon the form selected, cover surface area can be increased by 41% to 57% thereby adding to the convection capacity of the package. |
| 申请公布号 |
EP0174020(A3) |
申请公布日期 |
1987.03.11 |
| 申请号 |
EP19850111173 |
申请日期 |
1985.09.04 |
| 申请人 |
GTE PRODUCTS CORPORATION |
发明人 |
GILDER, THOMAS G.;O'DEAN, RAYMOND D. |
| 分类号 |
H01L23/36;H01L23/02;H01L23/367;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
| 代理机构 |
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代理人 |
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