| 摘要 |
<p>In equipment for assembling a plurality of electronic components (42) on a circuit board (50 including means (26A,26B,28,30) for manipulating the components relative to the board, and processor means for controlling the manipulating means in a predetermined sequence to effect assembly of the components on the board, repair apparatus for removing faulty components from boards after assembly comprising: a source of heat; means (72) for applying heat from said heat source to a faulty component to be removed from a board, said heat applying means being carried by and movable with the component manipulating means (26A,26B,28,30), and means for enabling the processor means selectively to activate said heat source, said heat applying means and the component manipulating means in a predetermined repair sequence to remove said faulty component from said board.</p> |
