| 摘要 |
PURPOSE:To prevent a wafer from cracking and scratching by a method wherein fin-like sheets are radially fixed on the lower part of a chuck main body. CONSTITUTION:Fin-like sheets 5 are radially fixed on the lower part of a chuck main body 1. The nearer to the periphery of the chuck main body 1, the higher the fins 5 while the parts of the fins 5 coming into contact with a wafer 4 are rounded not to scratch the wafer 4. As soon as the wafer 4 is attracted, the periphery of the same 4 comes into multiple point-contact with the fins 5 preliminarily fixed on the chuck main body 1 not to scratch the central part of the wafer 4. As for the subsidiary effect, any waste grown film produced from the surface scratches of the wafer 4 on the conventional chuck causing probable polution may be prevented from being produced due to lack of scratches. |
