| 摘要 |
<p>A method of screening resin-sealed semiconductor devices having a resin body for sealing and a semiconductor chip is mounted on a die stage having a first and second bars, said first and second bars extending from said die stage to opposite side surfaces of the body and having a first and second ends exposed to said side surfaces, which method comprises the steps of applying electric voltage between said first and second ends to heat the semiconductor chip, and subjecting the device to screening test.</p> |
