发明名称 |
Interconnection construction to thick film substrate |
摘要 |
An integral lead frame for a thick film substrate mounted in a housing has three portions. A first portion in the interior of the housing contacts the thick film substance with stress relieved terminals having an arcuate hoop and reduced width. A second portion includes vertical steps for changing the plane of the lead frame. The third portion includes a connector blade with a thickness greater than the terminal thickness.
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申请公布号 |
US4470648(A) |
申请公布日期 |
1984.09.11 |
申请号 |
US19820453396 |
申请日期 |
1982.12.27 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
DAVIS, DANIEL A.;HENRITZY, CHARLES L. |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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