| 摘要 |
PURPOSE:To prevent the pressure of an inner space from rising by utilizing the difference of thermal expansion coefficients of the resin of a resin vessel of a sealed structure and the metal for enclosing an air hole formed in the vessel to release pressure through air gaps formed between the metal and the resin when the vessel is heated to become high temperature. CONSTITUTION:An inner space is surrounded by a semiconductor element placed on a base plate 1, an insulating substrate 2, a silicone gel 4 filled on a terminal 3, a resin case 5 and a resin cover 6 secured with an adhesive on the case 5 to form a resin vessel of sealed structure. An air hole 8 which communicates with the space 7 from the outside of the cover 6 is opened, for example, at a part of the cover 6, and the hole 8 is closed by a metal 9 until passing the inside of the cover 6. In this case, the material of the cover 6 is necessarily larger in the thermal expansion coefficient than the metal 9. |
