| 摘要 |
PURPOSE:To enable alignment with high precision by a method wherein alignment data detecting means and map data forming means are provided to expose the exposure area of wafer referring to corrected map data. CONSTITUTION:Global alignment means 11, 16, 15, 14, 25, 19, 1 for global- aligning a wafer 4 with exposure means 2, 3, 1 as well as alignment data detecting means 3, 2, 22, 23, 14, 17, 25, 27 to detect the alignment data representing the alignment slip of exposure area ER in the central part using alignment marks MX, MY in exposure area ER of each shot in the central part of global-aligned wafer 4 are provided. Finally map data forming means 27, 25 to collect map data on exposure area ER formed in the central part and other parts of wafer 4 referring to the alignment data are provided to expose the exposure area ER on wafer 4 referring to the map data. |
