| 摘要 |
PURPOSE:To improve the moisture resistance making it feasible to mount a lead frame near any other conductors by a method wherein at least lower surface and sides of a guide are covered with resin-seal package while the end and upper surface of the guide are located inside the peripheral surface and the upper surface of a resin seal package. CONSTITUTION:A lead frame 4 is formed of a highly radiative metal sheet, such as copper sheet by patterning process utilizing a precision press forging machine etc. The lead frame 4 is composed of a fine frame 7 and three leads 2 extending from one side of the frame 7 in parallel therewith. In case of assembling a transistor, a chip 14 is fixed on a chip fixing part 10 of the lead frame 4 and the header part from a dam piece 8 to the end is resin-molded. In this case, a part of the lead frame 4 is covered with resin package 1 since the lead frame 4 is held between a mold type bottom force 16 and a top force 17 in reverse status and a cavity 18 is with resin 19. A guide 6 protruding between the side of the resin package 1 is lifted upward to be separated at a channel 13 due to stress concentration. Besides the unnecessary part of the lead frame 4 is cut off to be removed. |
