| 摘要 |
<p>PURPOSE:To make peeling off of the resin boundary from an input side conducting part to an output side conducting part difficult to occur and improve dielectric strength between the input side and output side by forming a photolinkage part with epoxy system resin which belongs to the same system as packaging resin. CONSTITUTION:A light emitting device 3 and a photodetector 4 are mounted on an element mounting part 1a and an element mounting part 2a respectively. Then wire bonding is carried out with gold wires 5 and, after the surface of the light emitting device 3 is lightly coated with silicon system resin 6, both of the light emitting device 3 and the photodetector 4 are solidly molded with transparent epoxy resin 7 which forms a phtocoupling part and further opaque epoxy resin 8, which contains light reflecting agent, is applied to the outside of the resin 7 as packageing molding and further lead terminals 1 and 2 are subjected to a bending process to complete a photocoupler. It is to be noted that the purpose of the coating of silicon system resin 6 is to avoid deterioration caused by current and, as the peeling-off at the boundary between the coating resin 6 and the transparent epoxy resin does not reach an output conducting part from an input conducting part, it can not be the cause of degradation of dielectric strength between the input side and the output side.</p> |
