| 摘要 |
<p>PURPOSE:To reduce the size of a chip by providing capacitance elements in all spaces between all bonding pads which are arranged in the circumference of an integrated circuit chip. CONSTITUTION:Bonding pads 4, 4... are arranged in the circumference of an integrated circuit chip divided by scribe lines 7. Further, capacitance elements 1 are provided between respective bonding pads 4. Necessary capacity is distributed to circuit blocks 3, 3, 3 and 3, which are provided at four corners of the chip respectively, by connecting necessary number of the capacitance elements 1 with external wirings 2. In the drawings, the reference numeral 5 denotes an I/O buffer and the reference numeral 6 denotes an internal cell.</p> |
