| 摘要 |
PURPOSE:To prevent the generation of defective products, by forming a protective film which prevents contamination of a semiconductor wafer face wherein polishing is not performed by using polishing liquid, on the semiconductor wafer face wherein polishing is not performed before a semiconductor wafer is mounted onto a polishing jig. CONSTITUTION:A semiconductor wafer 8 is mounted on an circular rotation plate 22 with an unpolished face 8a faced above before it is set to polishing jig A. After the semiconductor wafer 8 is fixed onto a rotation plate 22 by using the vacuum structure, the rotation plate 22 is rotated and driven. In addition, when the number of revolutions of the rotation plate 22 increases and reaches the specified value and the rotation is stabilized, a protective material 24 made of synthetic resin is released onto the unpolished face 8a of the semiconductor wafer 8 and a protective film 21 having an even thickness is formed on the surface of the unpolished face 8a of the semiconductor wafer 8 using centrifugal force. After the protective film 21 having an even thickness is formed on the surface of the unpolished face 8a, the semiconductor wafer 8 is mounted on an elastic layer 3 provided in a round hole 5 in template 4 with the unpolished face 8a of the semiconductor wafer 8 and an elastic layer 3 facing each other. Then, the semiconductor wafer 8 is mounted onto a polishing jig A by utilizing a wafer surface tension between the unpolished face 8a of the semiconductor wafer 8 and elastic the layer 3. |
