| 摘要 |
PURPOSE:To shorten the operation time of thin film peeling by raising a thin film by a thin-film raising means, spraying liquid between the raised thin film and a substrate and peeling the thin film in the guide direction of a peeled thin-film guide member, and discharging it by a thin-film discharging means. CONSTITUTION:A thin-film raising device I and a thin-film peeling device II are provided on the conveyance path for a printed circuit board 1. The thin-film raising member 4 of thin-film raising device I raises a part of the light transmissive resin film 1D of the printed circuit board 1 and then the liquid spraying device 5 of the thin-film peeling device II sprays the liquid between the raised thin film 1D and board. Then the peeled light transmissive resin film 1D is stuck on the peeled thin film guide member 6B and discharged by a discharge belt mechanism 6D while holding by a fixed belt conveyor 6A and a movable belt conveyor 6C. Thus, the operation time of thin film peeling is shortened. |
