| 摘要 |
PURPOSE:To remove one of the causes of defectives during a semiconductor pellet bonding step by providing a mechanism for reducing the swelling of an adhesive in a peripheral part of a semiconductor pellet bonding position of a frame member for bonding the semiconductor pellet. CONSTITUTION:A groove 14 is formed in a peripheral part of a tub 13. An Ag paste 12 is dropped on the tub 13 and a semiconductor pellet 11 is put on it. By pressing, the Ag paste 12 is pushed out to the peripheral part of the semiconductor pellet 11. Then, the pushed out Ag paste 12 flows into the groove 14 and stagnates there so that it does not swell along the semiconductor pellet 11. Accordingly, short is not caused by the contact of the Ag paste 12 with a bonding pad 17. |
