| 摘要 |
PURPOSE:To make it easy to remove moldings when the moldings are molded by a mold device where plungers are installed at the nose of a rod, by setting up removably a first plate mold having more than one penetrating hole for molding, and by pouring under pressure. CONSTITUTION:A lead frame being fit with a semiconductor device is preliminarily set between a removable top force 6 and a removable bottom force 7 and set up on the top force 5. After mold closing, molding material supplied into each pot 4A is pressed into each cavity 8 by a plurality of plungers 11, and filled to be molded. The molding material is pressed into through a gap between the spot facing part 4Aa of the pot 4A provided at the top force 4 and upper cavity 8A. Because the molding material can be directly transfered and loaded into the cavity from the pot part, the efficiency of transfer of the molding material can be increased. |
