摘要 |
PURPOSE:To obtain the title wafer processing device of small type having an excellent operationability by a method wherein an input buffer carrier, an output buffer carrier, and a wafer carrying means are arranged on the front part of the main body of the processing device. CONSTITUTION:An input buffer carrier 3', an output buffer carrier 3, and a wafer carrying means are arranged on the front part of the main body of the title wafer processing device. The wafer is placed in the main body from outside the device using a carrying-in track 23. The wafer is stopped temporarily at the lower part of a prealignment station 7. Then, when the fact that the wafer reached to the abovementioned position is detected, the wafer is carried to the prealignment station 7 located at the upper part by a pantograph hand 15, and a prealignment operation is started. As a result, a small type wafer processing device having excellent operationability can be obtained.
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