发明名称 |
Assembly for packaging microcircuits having gold plated grounding and insulating leads, and method |
摘要 |
A plated metal assembly used for packaging hybrid microcircuits features both insulated and grounding leads plated with successive layers of nickel and gold, the leads attached to a metal header which is plated only with nickel. A method for mass producing the assembly includes pre-plating the grounding leads, and brazing them to the header after the header and insulated leads have been assembled and plated.
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申请公布号 |
US4706382(A) |
申请公布日期 |
1987.11.17 |
申请号 |
US19850772074 |
申请日期 |
1985.09.03 |
申请人 |
NORTH AMERICAN PHILIPS CORPORATION |
发明人 |
SUPPINGER, ALBERT V.;TINLEY, CHARLES W. |
分类号 |
H01R43/20;(IPC1-7):H01R43/20 |
主分类号 |
H01R43/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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