| 摘要 |
PURPOSE:To restrain the distortion generated in a chip of an integrated circuit device by mutually fixing the chip of the semiconductor integrated circuit device and a ceramic substrate by placing a thin plate made of a material, Kovar between these. CONSTITUTION:The chip 1 of a semiconductor integrated circuit device is placed on a thin plate 3 made of a material, Kovar mounted on a ceramic substrate 2 and the chip 1 and the substrate 2 are mutually fixed by placing the thin plate 3 between these. Then, the mechanical stress generated by heating at the time of installation and assembly is absorbed and the residual mechanical distortion in the chip 1 is reduced.
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