| 摘要 |
PURPOSE:To improve reliability by mounting an IC chip to peripheral circuits and executing an electrical inspection prior to filling of a liquid crystal thereto thereby permitting the inspection and repair thereof. CONSTITUTION:Light transmissive electrodes and leads 2, 2' as well as the peripheral circuits 4, 4' of metal are formed on a pair of the glass substrates 1, 1'. The IC chip 5 which is a semiconductor integrated circuit is then connected by a copper bump 6 and conductive paste to the peripheral circuits 4, 4'. The mounting condition of the IC chip 5 and the electrodes and leads 2, 2' are electrically inspected in this state and are repaired if there is any defective point. Since the two substrates are stuck to each other and the liquid crystal 3 is filled therebetween after such inspection and repair, the inspection and repair during the manufacturing process which are heretofore impossible are permitted. The improvement and the yield of the manufacture are thereby improved and the cost is reduced. |
