| 摘要 |
<p>PURPOSE:To prevent an adverse influence to a semiconductor element or bonding wirings by forming a coating layer on the element thick at the periphery and thin at the center. CONSTITUTION:The bonding portion of a wire 13 of a semiconductor element 12 secured to a head 11 of a lead frame is formed in a spherical shape, and the surface of the element 12 is coated with resin 14 such as polyimide, epoxy or silicon. The layer thickness is thin at the center 14a and thick at the periphery 14b. Resin is dropped to the center of the element 12, air is injected to be extended to the entire surface, or resin is coated by spraying so that the thickness of the periphery 14b is particularly lower than the height of the wire ball. A stress applied to the element 12 is reduced to prevent the operation of the element from becoming improper or wirings from being disconnected.</p> |
