| 摘要 |
PURPOSE:To cope with a semiconductor device with numerous terminals by a method wherein the contacts of a testing device are brought into contact with the test pads of a substrate for selection to conduct necessary electrical tests on a semiconductor element, and after that the leads are cut to separate the semiconductor element from the substrate. CONSTITUTION:The metal protruded materials of a semiconductor element 1 are bonded to leads 14 provided on a film carrier tape 11. The leads 14 and the tape 11 are cut in the vicinities of suspenders 16, and the semiconductor element 1, the leads 14 and the suspenders 16 are separated from the film carrier tape 11. The leads 14 are bonded to the bonding pads 19 of a substrate 17 for selection. in this state, the contactors of a testing device are brought into contact to the test pads of the substrate 17 for selection to conduct electrical selection and bias tests. In this case, since holes 20 are ready-formed in the substrate 17 for selection, to contrive automating of the tests is easy. As a result, the workability is improved, thereby enabling to cope with mass production. Then, the leads 14 are cut at an arbitrary place to be separated from the substrate 17 for selection and the suspenders 16. |
