| 摘要 |
<p>The acid soln. comprises molybdenum together with sufficient peroxide to oxidise the molybdenum and provide sustained etching. The molybdenum content is sufficient to provide an etch rate greater than that achievable by peroside alone. Pref. the peroxide concn. is 0.5-2.5 moles/l and the Mo concn. 0.02-0.5 moles/l. H2O2 is pref. in an H2SO4-contg. soln. for etching Cu, or an HCl-contg. soln. for Ti. The soln. is used partic. for etching Cu in the prodn. of printed circuit boards. Mo is not consumed and replenishment only of peroxide is required.</p> |
