| 摘要 |
<p>A planar magnetron sputtering apparatus having a magnetic source (10; 50) which is rotated eccentrically around anaxis (11) of a target (13) and has a particular arrangement (10; 50) or a plurality of permanent magnets (30, 31; 41; 51, 52) to form a magnetic field. Using this particular arrangement of permanent magnets (30, 31; 41; 51, 52), the target surface is exposed to a plasma (33; 55; 67; 71-80, 71'-80') for the same period of time, and this increases the uniformity of the target erosion and deposits the sputtering material uniformly on a substrate (16), as a result, an increase of the lifetime of the target (13) can be expected. </p> |
