发明名称 |
Composition for protective coating material |
摘要 |
There are disclosed a composition for protective coating material, preferably for a protective coating material of a semiconductor device which is constituted of principal elements of a semiconductor memory element, an encapsulating layer containing an inorganic material for encapsulating said element and a layer of a cured protective coating material arranged between said memory element and said encapsulating layer, which is composed of a polyamide acid obtained by the reaction of a diaminosiloxane, an organic diamine containing no silicon and an organic tetrabasic acid dianhydride, and a semiconductor device having a layer of a cured protective coating material composed of a polyimide-silicone copolymer obtained by dehydrating ring closure of the above-mentioned polyamide acid.
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申请公布号 |
US4645688(A) |
申请公布日期 |
1987.02.24 |
申请号 |
US19840679460 |
申请日期 |
1984.12.07 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MAKINO, DAISUKE;SATO, HIDETAKA;SUZUKI, HIROSHI;UCHIMURA, SHUN-ICHIRO;SUZUKI, HIROSHI |
分类号 |
C08G73/10;C08G77/54;H01B3/30;H01B3/46;H01L23/29;(IPC1-7):B05D5/12 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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