| 摘要 |
Alignment of a plurality of thinned substrate solid-state imagers mounted at the outputs of an optical assembly is accomplished optically, without the necessity to electrically operate the imagers. Light blocking alignment indicia, such as a chevron pattern, are deposited over the electrode structure of the chip. When the imagers are positioned at the optical assembly outputs and light is used to illuminate the imagers electrode structure side, the alignment indicia are visible at the optical assembly input and can be used for alignment of the imagers.
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