发明名称 Continuous process for the sequential coating of polyamide filaments with copper and silver
摘要 A method of continuously sequentially coating polyamide filaments with copper and silver which utilizes as a key step in the process the use of a wetter solution containing alcohol, a detergent and an ethylene oxide and propylene oxide copolymer surfactant. The filaments are in the form of multi-filament tows, roving, woven tape or fabric and the steps involve immersing the filaments in a sodium hydroxide trisodium phosphate cleaning solution, followed by a water rinse and then immersion in the wetter solution, followed by water rinse and then followed by a conventional commercial pre-activator, then a commercial palladium chloride/stannous chloride catalytic activator, followed by commercial autocatalytic copper plating as a first copper plating step, followed by a subsequent copper plating step from a copper cyanide bath, followed by a conventional silver plating step, with appropriate water rinses after each of the plating steps, and finally with an alcohol rinse and drying.
申请公布号 US4645574(A) 申请公布日期 1987.02.24
申请号 US19850729827 申请日期 1985.05.02
申请人 MATERIAL CONCEPTS, INC. 发明人 ORBAN, RALPH F.
分类号 C23C18/16;(IPC1-7):C23C18/30 主分类号 C23C18/16
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