发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To shorten a wire for connecting a specific external lead in a DIP, on one side thereof an odd numbered external leads are arranged, by displacing a middle external lead in the external leads from the center line in the longitudinal direction of a die stage. CONSTITUTION:A middle external lead 12a in an odd number of external leads 12 is positioned at the center of a package, and a center line C in the longitudinal direction of a die stage 15 is displaced and disposed from the center L of the package. Consequently, the middle external lead 12a in the external leads 12 is displaced from the center line C, thus making the length of a wire connecting the external lead 12a and a pad 19a the same as other wires. Accordingly, the wire is not made to flow and is not brought into contact with other wires.
申请公布号 JPS6242552(A) 申请公布日期 1987.02.24
申请号 JP19850182272 申请日期 1985.08.20
申请人 FUJITSU LTD 发明人 AOKI TSUYOSHI;INOUE OSAMU
分类号 H01L21/60;H01L23/495 主分类号 H01L21/60
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