| 摘要 |
PURPOSE:To reduce Zo of a power supply line and to acquire stable operation by performing wiring between opening parts of a chip protecting film provided on a semiconductor device surface. CONSTITUTION:An Al wiring Vss 1 is connected to an external Vss terminal and wired to transmit its electric potential to an inner circuit. Similarly, Al wirings VDD 2a, 2b supply a voltage to the inner circuit from an external Vdd terminal. The Al wiring VDD 2a is connected to a wire 3 through a wire bond part 5a at a chip protecting film opening part 4a while supplying a voltage to an inner circuit in the middle from external Vdd terminal by an Al wiring, and is connected to the Al wiring VDD 2b again through a wire bond part 5b. The Al wiring VDD 2b is wired as a power supply of the inside of a semiconductor device to supply a voltage to an inner circuit likewise VDD 2a. Thereby, Zo of a power supply line is reduced and stable operation can be acquired. |
